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Datasheet FPM K3A



PANchromatic Focal Plate Module K3A

Fully assembled K3 FPA - view from sensor/baffle side

Image: DLR RM-OS

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For the both earth observing satellites KompSat-3 (launch 2011) and KompSat-3A (launch 2013) DLR-OS got the order from the South Korean space agency KARI (Korea Aerospace Research Institute) to design and assemble the complete Focal Plate Assembly (FPA), each consisting of 2x PANchromatics and 4x MultiSpectral Focal Plate Modules (FPM).

Hereafter the K3A PANchromatic FPM will be described shortly.

 

Parameter

Value

 

FPM PAN

FPM Size

H x W x L = 18 mm x 325 mm x 170 mm

FPM Weight

1500 g (TBR)

Power dissipation

40 W

Cooling

by heatpipe system

Operating Temperat.

0 to 40°C (full performance rabge 14 to 26°C)

Electronics

476 active and 2640 passive elctronics parts (space qualified)

PCB

2x 12 + 2x 10 Layer Polyimid with Metal Core

Data-I/F

4x ChannelLink (DS217), max. speed 490 Mbps per Link

Real Time Correction

DS, DSNU, PRNU

Channel Dynamics

14 bit

Channel SNR

> 120

Features

Programmable Gain and Offset

CCD Sensor PAN

Number of Pixels

24.000 = 2x 12080 pixel dies staggered with overlap

Pixel Pitch 

8.75 µm x 8.75 µm

Sensor Flatness

< 30 µm over full length (21 cm)

No. of TDI stages

1, 8, 32, 64 selectable

Binning

1 x 1 Pixel

No. of Video Outputs

16

Read out Frequency

25 MHz per Video Output

Line Rate

≤ 14.2 kHz

Dynamic Range

> 5000

Full well

> 400.000 e-

Conversion factor

≤ 5 µV/e-

Fillfactor

75%

Filter Transmission 

76%

l

PAN 450-900nm

Dl

PAN 400 nm

Front view of one fully asembled K3 FPA PAN module

Bild: DLR RM-OS

 

 

 

 

 

 

 

 

MultiSpectral Focal Plate Module K3A

Hereafter the K3A MultiSpectral FPM will be described shortly.

Parameter

Value

 

FPM MS

FPM Size

H x W x L = 18 mm x 325 mm x 170 mm

FPM Weight

1500 g (TBR)

Power dissipation

20 W

Cooling

by heatpipe system

Operating Temperat.

0 to 40°C (full performance range 14 to 26°C)

Electronics

450 active and 1950 passive electronics parts (space qualified)

PCB

2x 12 + 2x 10 Layer Polyimid with Metal Core

Data-I/F

2x ChannelLink (DS217), max. speed 250 Mbps per Link

Real Time Correction

DS, DSNU, PRNU

Channel Dynamics

14 bit

Channel SNR

> 120

Features

Programmable Gain and Offset

CCD Sensor MS

Number of Pixels

12.000 = 2x 6040 pixel dies staggered with overlap

Pixel Pitch 

17.5 µm x 17.5 µm (35 µm x 35 µm binned)

Sensor Flatness

< 30 µm over full length (21 cm)

No. of TDI stages

1, 8, 32, 64 selectable (1, 4, 16, 32 binned)

Binning

2 x 2 Pixel

No. of Video Outputs

4

Read out Frequency

12.5 MHz per Video Output

Line Rate

≤ 3.55 kHz

Dynamic Range

> 5000

Full well

> 500.000 e-

Conversion factor

≤ 5 µV/e-

Fillfactor

85%

Filter Transmission 

76%

l

B 450-520nm, G 520-600nm, R 620-690nm, NIR 760-900nm

Dl

B 70 nm, G 80 nm, R 70 nm, NIR 140 nm


Contact
Dipl.-Ing. Elektrotechnologie Stefan Hilbert
German Aerospace Center

Institute of optical Sensor Systems
, Optical sensorics and electronics
Berlin-Adlershof

Tel.: +49 30 67055-544

Fax: +49 30 67055-532

Links
Missionsstatus KompSat-3
Related Topics
Electronics and Electrical Engineering
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