Workshop “Multi-scale, Multi-physics and Coupled Problems on highly parallel systems (MMCP)”
HPC Asia 2024, January 25 - 27, Nagoya, Japan

 

Links:

Conference webpage: HPC Asia 2024 https://sighpc.ipsj.or.jp/HPCAsia2024/

Description:

This workshop will provide a platform for presentations and discussions on advanced numerical simulation for complex multi-scale, multi-physics and coupled problems. The workshop will gather researchers (computer scientists, engineers, mathematicians, physicists, chemists, biologists, material sciences etc.) working on different disciplines but all facing challenges in multi-scale and multi-physics as well as coupled simulations on HPC systems.

Applications with different characteristics in parts of the computational domain can lead to unexpected performance issues. The optimum setting for one part might be contradictory to the optimum for another; the overall optimum might be a non-optimal, but still a satisfactory compromise for researchers.

Several approaches have been examined while developing different solutions, depending on the application and hardware combination. On the application side, monolithic or partitioned approaches have been introduced; on the hardware side, homogeneous and heterogeneous cluster settings. All combinations have advantages and disadvantages, all leading to the following question: how to find the optimal configuration and setting of all parameters, with respect to quality of solution vs. computational efficiency?

The goal is – of course – the performance and efficiency of each component (region or solver), but the characteristics of other scales, other physical phenomena might change the game. Also, a coupling tool might introduce, e.g., load imbalances or hinder the overlapping of communication and computation.

The focus of the workshop will be on computational issues regarding performance and suitability for high-performance computing. Furthermore, the underlying strategies to enable large simulations will be highlighted.

Keeping these aims in mind, contributions from all aspects of engineering applications will be considered. Topics of applications will include (but are not be limited to):

• Multi-scale problems
• Multi-physics problems
• Molecular Dynamics
• Multi-Domain/Concurrency
• Multi-scale and/or multi-physics modelling for biomedical or biological systems
• Novel approaches to combine different scales and physics models in one problem solution
• Challenging applications in industry and academia, e.g. turbulence and multiphase flows, fluid-structure interactions, chemical engineering, material science, biophysics, automotive industry, …
• Load balancing
• Adaptivity
• Heterogeneous architectures
• New algorithms for parallel-distributed computing, specific to this topic.

Organizers/Chairs:

Prof. Dr.-Ing. Sabine Roller

Dr.-Ing. Neda Ebrahimi Pour

Prof. Dr. Ryoji Takaki

Program Committee members (to be confirmed):

• Akiko Matsuo, Keio University, Department of Mechanical Engineering, Japan
• Benjamin Uekermann University of Stuttgart, SimTech – Cluster of Excellence, Germany
• Hiroyuki Takizawa, Tohoku University, Department of Mechanical Engineering, High Performance Computing, Japan
• Ryusuke Egawa, Tokyo Denki University, Department of Information and Communication Engineering, Japan
• Hartwig Anzt,  University of Tennessee, Department of Electrical Engineering and Computer Science, USA
• Osni Marques, Lawrence Berkeley National Laboratory, Computational Research Division, USA
• Andrea Beck, University of Stuttgart, Institute of Aerodynamics and Gas Dynamics, Germany
• Pascal Omnes, Atomic Energy and Alternative Energies Commission, France

Format and Submission Guidelines:

All authors should submit manuscripts for review in a single-column format. Manuscripts must be at least 4 pages and at most 18 pages in PDF format including figures and references, formatted according to the ACM Proceedings Style. ACM has partnered with Overleaf and the ACM LaTeX template on Overleaf platform is available. Please use the templates in “STEP 1” according to the following page: https://www.acm.org/publications/authors/submissions. Please note that there are two different instructions for Word and LaTeX template users. Papers are submitted for the review to EasyChair (“STEP 2”) using the following link: https://easychair.org/conferences/?conf=mmcp24

ACM Templates

Word:

https://www.acm.org/binaries/content/assets/publications/taps/acm_submission_template.docx

LaTeX:

https://authors.acm.org/proceedings/production-information/preparing-your-article-with-latex

(use a “manuscript” format option (Please refer to sample/sample-manuscript.tex))

Overleaf:

https://www.overleaf.com/latex/templates/acm-conference-proceedings-primary-article-template/wbvnghjbzwpc

(use a “manuscript” format option)

Important dates:

Submission deadline: November 8, 2023 (extended)

Notification of Acceptance: December 5, 2023

Camera-ready paper: TBA

Conference date: January 25-27, 2024

Dr. Neda Ebrahimi Pour
Wissenschaftliche Mitarbeiterin
Institut für Softwaremethoden zur Produkt-Virtualisierung, Hochleistungsrechnen
Dresden
Tel.: +49 351 210718 150